Above is the title of my invited talk in The 13th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems (IEEE NEMS 2018), held in Singapore from April 22-26, 2018.
Below is the abstract of my talk:
With increasing demands for quality and affordable healthcare services, organizations in the medical device manufacturing industry are embracing more intelligent and responsive systems through the integration and development of dynamic digital technologies. We propose a Cyber-Physical System (CPS)-based production system with integrated enabling digital technologies and robot assistance. This system has the potential to enhance productivity and sustainability, particularly in the production of patient-specific hybrid medical devices. Hybrid medical devices incorporate multiple components and materials that must function flawlessly over extended periods, often under the demanding conditions of the human body. Examples of hybrid medical devices include artificial tracheas, artificial pancreases for diabetes treatment, and information-delivering microchips.
The proposed CPS-based manufacturing system utilizes an integration of enabling digital technologies, including Augmented Reality (AR), Wireless Sensor Networks (WSN), the Internet of Things (IoT), and Artificial Intelligence (AI), for the fabrication of patient-specific medical devices. Visual and haptic cues are provided to the human operator in a timely manner, allowing for swift intervention. Importance-driven computer graphical rendering of visual cues is embedded into physics-based simulations for haptic rendering.
The study of human centricity in an immersive and robot-assisted environment will provide unique insights into human hand-eye coordination capabilities under external influences. Intriguing scientific questions include the extent to which individuals can learn and develop motor skills with external guidance.
Note: There is an IEEE SMC Technical Committee (TC) on Cyber-Medical Systems. More information of the TC can be found here.